Device Manufacturing

Majority of market players in SiC device are using their own 100mm technology  fabrication facilities in manufacturing. Our company jump start the SiC production at 150mm Si foundry fab to improve device yield per substrate and cut down production costs. We are the first company in China started with  150mm SiC wafers devices processing in 2015. We replaced a few key processes with state of the art processes to simplify the process flow. We also developed a novel process to make the process flow much simpler and without having cross metallic contamination in conventional low cost Si foundry fab. As such, we have clear cost advantage over our peers.

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